Pilot Fab.
Pilot Fab.
□ In-line Sputtering System
- Plasma pretreatment, Synthesis of multilayer films, Pilot scale continuous mass production equipment
- Magnetron source: 12 ea
- Chamber size: 350 × 800 × 6500 mm3 (5 chamber)
- Target size : 100 × 520 mm2
- Target materials : Si, ITO, Cr, Ag, Al
□ Confined Field Sputtering System
- Synthesis of multi-compound films by using high efficiency moving magnetron sputtering sources
- revolution and rotation jig system
- Chamber size: 850 × 850 × 700 mm3
- Target size : 375 ×120 mm2
- Target materials : Si, Cr, Ag, Al, NiCr, Cu, Ti
□ Multi-purpose Process System
- Equipment for test of various plasma sources
- Functional powder coating and plasma process
- Chamber size: φ 800 × 1200 mm3
- Target materials : Si, Cu, W, Au
□ Electroplating System
- Synthesis of high speed, high quality, low cost thin films
- Substrate size: 200 × 300 mm2
- Materials : Cu


In-line Sputtering System
- Plasma pretreatment, Synthesis of multilayer films, Pilot scale continuous mass production equipment
- Magnetron source: 12 ea
- Chamber size: 350 × 800 × 6500 mm3(5 chamber)
- Target size : 100 × 520 mm2
- Target materials : Si, ITO, Cr, Ag, Al


Confined Field Sputtering System
- Synthesis of multi-compound films by using high efficiency moving magnetron sputtering sources
- revolution and rotation jig system
- Chamber size: 850 × 850 × 700 mm3
- Target size : 375 ×120 mm2
- Target materials : Si, Cr, Ag, Al, NiCr, Cu, Ti


Multi-purpose Process System
- Equipment for test of various plasma sources
- Functional powder coating and plasma process
- Chamber size: φ 800 × 1200 mm3
- Target materials : Si, Cu, W, Au


Electroplating System
- Synthesis of high speed, high quality, low cost thin films
- Substrate size: 200 × 300 mm2
- Materials : Cu