List of major Patent
Patent Application

NO Title Application
Number Date Nation
16 Manufacturing method for micro coaxial cable having double metal shield layers 10-2010-0055950 2010.06.14 South Korea
15 The low temperature crystalline structure silicon thin film synthetic method by large area target sputtering system 10-2010-0012703 2010.02.11 South Korea
14 Apparatus and method for treating substrate using plasma 10-2010-0009953 2010.02.03 South Korea
13 Micro coaxial cable comprising coated metallic shield and method for manufacturing the same 10-2010-0009625 2010.02.02 South Korea
12 Method for forming an anti finger printing film 10-2010-0005455 2010.01.21 South Korea
11 Apparatus and method for treating substrate using plasma 10-2009-0058785 2009.06.30 South Korea
10 Apparatus and method for manufacturing stress-free flexible printed circuit board 12/034,707 2008,02,21 USA
9 Planar magnetron apparatus 10-2008-0013079 2008.02 South Korea
8 Electronic apparatus & film forming method 10-2007-0021892 2007.03 South Korea
7 Nano gold cereals and method thereof 2006-38488 2006.04.28 Japan
6 High efficiency magnetron sputtering equipment 10-2002-0045758 2002.08.02 South Korea
5 Planar-type Magnetron Sputtering Apparatus 1120811 2001.08 Europe
4 Planar-type Magnetron Sputtering Apparatus 09/768,378 2001.01. 23 USA
3 The equipments, processing method and films of super hard WC-CrN superlattice coatings 10-2001-0072620 2001.11.21 South Korea
2 Surface treatments of metals by chromizing and ion nitriding 10-1998-0048049 1998.11.10 South Korea
1 High rate vacuum plating method of non environmental pollution 10-1998-0026961 1998.07.04 South Korea


Patent registration

NO Title Registration
Number Date Nation
25 Apparatus and method for coating conductive carbon 10-0954287-0000 2010.04.14 South Korea
24 Method of coating barium zircon oxide 10-2008-0112575 2008.12.26 South Korea
23 Apparatus and method for manufacturing stress-free Flexible Printed Circuit Board 10-0888145-0000 2009.03.03 South Korea
22 Apparatus for vacuum treatment and the vacuum-treating method for pluverulent body using it 10-2008-0084140 2008.09.19 South Korea
21 Method for Etching ZnO Thin Film Using Inductively Coupled Plasma 10-0693080-0000 2007.03.05 Japan
20 Apparatus and method for coating nanostructure of conductive carbon 10-0686318-0000 2007.02.15 South Korea
19 Method for manufacturing flexible printed circuit boards 10-0642201-0000 2006.10.27 South Korea
18 Method for manufacturing flexible printed circuit boards 10-0675600-0000 2007.01.23 South Korea
17 A vibration plate of micro-speaker 10-0592100-0000 2006.06.14 South Korea
16 Sputtering apparatus of circle magnetron 10-0559246-0000 2006.03.03 South Korea
15 Coating systhesized on the parts of motor engines and coating apparatus 10-2003-0091918 2003.12.03 South Korea
14 A vibration plate of micro-speaker 10-2003-0028795 2003.04.10 South Korea
13 Ozone-sterilizable Plasma Air Cleaner 10-2004-0035092 2004.04.29 South Korea
12 Super hard WC-TiAlN superlattice compound coating layer 10-0522542-0000 2005.10.12 South Korea
11 Anti-abrasion pipe fittings for high-speed particle-laden flow 6,422,608 2002.07 USA
10 Planar-type Magnetron Sputtering Apparatus 3602060 2004.10.01 Japan
9 Magnetron source for coating of ferro-magnetic materials 10-0397751-0000 2003.08.29 South Korea
8 Planar magnetron apparatus 10-0344188-0000 2002.07.02 South Korea
7 The equipments, processing method and films of WC-TiAlN superlattice coatings 10-0345923-0000 2002.07.12 South Korea
6 Planar magnetron apparatus 10-0345924-0000 2002.07.12 South Korea
5 Large area coating equipments by cathodic arc ion plating 10-0329632-0000 2002.03.11 South Korea
4 The equipments, processing method and films of WC-TiAlN superlattice coatings 10-0345923-0000 2002.07.12 South Korea
3 The sputtering equipment for low temperature poly-Si and functional films by high rate pulsed DC magnetron sputtering 10-0310784-0000 2001.09.20 South Korea
2 Anti-abrasion pipe fittings for high-speed particle-laden flow 10-0289667-0000 2001.02.21 South Korea
1 High rate deposition method of conductivity ceramics and metal composite materials 10-0329630-0000 2002.03.11 South Korea